Fortsense has reportedly closed a Series C4 exceeding roughly $60 million as the automotive lidar chip supplier develops a sensor combining color images and distance readings for a planned 2027 rollout. PE Daily reported the financing on November 12, naming investors including Xintong Electronics, Jingce Electronics and Huarui Investment.

Fortsense supplies SPAD chips, light detectors used inside lidar systems that measure a vehicle’s surroundings. In an October 15 announcement, Fortsense said its automotive chips were in mass production for several carmakers and cumulative shipments had exceeded one million units.

In an August 8 stock-exchange filing, Xintong described Fortsense as still ramping chip production and not yet consistently profitable. Figures are in US dollars, converted at November 12, 2026 reference rates.

Fortsense’s planned RGBD chip would collect color images and depth readings together, reducing the calibration needed for separate sensors, according to its October 24 technical update. The company said customers could reuse much of the optics from its existing solid-state lidar design, and targeted samples and mass production for 2027.

Xintong is also a development partner. The companies signed an agreement on October 14 to pursue sensing technology for electricity, telecommunications and new energy industries, including power-line inspections and industrial monitoring, according to Fortsense’s announcement.

Sources
1PE Daily: 阜时科技完成超4亿元C4轮融资,加速物理AI空间感知芯片布局 ↗
2Fortsense: 色彩与距离,一颗芯片全搞定|阜时科技RGBD单芯片锁定行业领先身位 ↗
3Fortsense: 阜时科技与深交所主板上市公司信通电子达成战略合作 ↗
4Xintong Electronics: 关于对外投资的公告, August 8, 2026 ↗
5CurrencyBeacon: USD to CNY Exchange Rate Dashboard ↗
6Zero2IPO Research via Sina: 浙江 | 10月VC/PE市场数据动态 ↗