Lingchuan Technology, the chipmaker spun out of Kuaishou, has reportedly completed an approximately $150 million Series B ahead of planned mass shipments of its next-generation 3D chips in 2027. Chinese business publication 36Kr reported the financing and shipment timetable on November 4.
The company became independent in March 2024. Its existing SL200 processor combines video encoding, AI inference and CPU functions, helping internet companies compress and process video in their data centers. Lingchuan also packages the chip into accelerator cards and equipment for local video analysis.
In a July 2 account of the business, investor Shouyi said SL200 shipments had approached 100,000 chips, with deployments at Kuaishou, Alibaba Cloud, Baidu Cloud and Bilibili. It said the processor handled 99.7% of Kuaishou’s livestream transcoding, converting video for distribution to viewers.
The Series B follows an A+ round reported by 36Kr on June 23. That earlier financing was intended to fund next-generation chip development, SL200 production expansion and overseas sales. Figures are in US dollars, converted at November 3, 2026 reference rates.
Lingchuan’s team told 36Kr in June that its next-generation chip had completed tape-out in April. The design uses domestic 3D stacking technology to place memory close to processing circuitry, with engineering work addressing heat, timing consistency and reliability.